Unit 4039 Semiconductor Manufacture Assignment Brief 2026

Unit 4039 Assignment Brief

Introduction

Semiconductor device fabrication is a complex production process, involving varying technologies, concepts and specialist equipment and techniques. Each activity can be prone to defects, causing costs to rise and failure to meet customers specifications and reliability. The manufacture of semiconductor wafers and module packages is highly automated to ensure standards are met and yield is maximised.

This unit investigates the equipment and processes used in automated semiconductor device production and module assembly. The physical dimensions  of the materials that are being processed are exceedingly small (<10nm) and so to prevent risk of contamination and defects the automatic production environment  is hermetically sealed. The external working area is supplied with filtered air. In manufacturing semiconductor devices, it is important to be confident that the device will meet specifications, testing and data collection is both manual and automated, and the information used to confirm process quality and meet wafer yield predictions; any defects are identified and corrective actions taken.

The equipment and techniques used are specialised and it is important to become familiar with the technical language and concepts used to fully develop your skills.

On successful completion of this unit, students will be able to work effectively within the increasingly complex semiconductor manufacturing systems in the semiconductor industry.

Learning Outcomes

By the end of this unit students will be able to:

LO1 Describe the operational characteristics, selection criteria and application of equipment used in automated systems for fabricating semiconductor devices

LO2 Explain the individual process stages in producing a semiconductor wafer suitable for further processing in an automated semiconductor fabrication plant

LO3  Discuss the processes necessary to take a semiconductor wafer and produce  a finished integrated circuit in an automated semiconductor fabrication plant

LO4 Demonstrate how the data collected during the semiconductor manufacturing process from inspection and testing is used to improve the yield of each integrated circuit to final packaging.

Essential Content

LO1 Describe the operational characteristics, selection criteria and application of equipment used in automated systems for fabricating semiconductor devices

Semiconductor device fabrication:

Overview of the entire semiconductor device fabrication manufacturing process

Introduction to terminology, e.g. wafers, deposition, removal, growth, patterning, modification, insulation, interconnectivity

Underlying principles of how the first semiconductors (Germanium (Ge) and

Silicon (Si) material and Negative-Positive-Negative (NPN) and Positive-NegativePositive (PNP) transistors) were produced. Characteristics of Bipolar junction devices

A systems approach to integration of semiconductor devices

Principles of Metal-Oxide-Semiconductor (MOS) technology, Metal-OxideSemiconductor-Field-Effect-Transistor (MOSFET).

Operational characteristics and selection of automated equipment for semiconductor fabrication:

System characteristics of generic semiconductor automated fabrication equipment, e.g., modular, unitary and rack mounted systems electrical/mechanical/power characteristics, electronic parameters-speed,  scan time, memory, Human Machine Interface, Input/output requirements, communication standards.

LO2 Explain the individual process stages in producing a semiconductor wafer suitable for further processing in an automated semiconductor fabrication plant

Producing a Pure Silicon wafer:

The need for a clean environment

Producing a silicon ingot, Czochhralski or Floating Zone process

Semiconductor purity

Preventing contamination.

Cutting the individual wafers:

Surface treatments, solvents, polished to obtain a very regular and flat surface

Thermal Oxidation

Testing of wafer-conductivity

Automatic handling and storage

Equipment needed to produce a semiconductor wafer, e.g., furnaces for oxidation and gas application, cutting tools to slice the silicon ingot into wafers, cleaning and surface treatment equipment, testing equipment for wafer flatness, surface conductivity, wafer automatic handling equipment.

LO3 Discuss the processes necessary to take a semiconductor wafer and produce a finished integrated circuit in an automated semiconductor fabrication plant

Wafer fabrication (Front-End):

Multi-step wafer fabrication process. i.e. photo-masking; etching; diffusion;  ionic implantation; metal deposition; passivation and back-lap

Wafer-probing, i.e. process parametric test, full wafer probing test, bad die marked for removal after wafer is cut

Equipment needed to perform front-end wafer fabrication, e.g., diffusion furnaces, pumps to control flow of gasses, Ion implantation and vacuum equipment, Physical Vapour Deposition system, evaporation and sputtering chambers, Chemical Vapour Deposition equipment, photolithography equipment – resist coating – soft bake ovens – exposure equipment – development of resist to remove or retain mask pattern, wet and dry etching (Chemical or Plasma), waste removal equipment, automatic testing and sorting equipment, automatic handling equipment.

Wafer packaging and module assembly (Back-End):

Assembly, i.e. die cutting; inspection and sorting; die attachment to a frame or substrate; wire bonding (or alternative); further inspection and sorting; package encapsulation; leads cutting (if necessary); lead tinning (if necessary); marking; surface mount technology (SMT) and final test

Equipment needed to perform back end wafer fabrication, e.g. assembly process equipment includes – die cutting equipment and die attachment/bonding machines- automatic handling/holding- pick and place machines, wire bonding equipment and tools – die placement equipment, glass passivation equipment, moulding process equipment, high precision dispensers, deflash, trim, form and singulation machine (DTFS), solder paste printers, SMT component placer, flux wash system, laser marking and final automatic quality test equipment.

LO4 Demonstrate how the data collected during the semiconductor manufacturing process from inspection and testing is used to improve the yield of each integrated circuit to final packaging.

Data collection:

Automated data collection during manufacturing process

Automatic visual tests to identify defects caused by process activity

Critical Dimension Scanning Electron Microscope (CDSEM) Go-No/Go Tests

Parametric test- dynamic checks.

Batch production testing issues.

Yield analysis:

Types of faults/defects recorded and analysed to improve future performance

Failure Mode and Effects Analysis (FMEA)

Process Failure Mode and Effects Analysis (PFMEA).Equipment needed to perform data collection and yield analysis, e.g. automatic test equipment, visual automatic inspection system, data acquisition equipment, software programmes to analyse the data and inform operators in real time. Yield management processes and control plans.

Learning Outcomes and Assessment Criteria